IPC-HDBK-001 Handbook and Guide to the Requirement for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B 已焊接電子組裝件的要求手冊(cè)與導(dǎo)則 135頁
J-STD-001D Requirements for Soldered Electrical & Electronic Assemblies 電氣與電子組裝件錫焊要求 69頁
J-STD-002B Solderability Tests for Component Leads,Terminations,Lugs,Terminals and Wires 元件引線、端子、焊片、接線柱及導(dǎo)線可焊性試驗(yàn) 40頁
J-STD-003A Solderability Test for Printed Boards 印制板可焊性試驗(yàn) 30頁
J-STD-004A Requirements for Soldering Fluxes錫焊焊劑要求 20頁
J-STD-005 Requirements for Soldering Pastes 焊膏技術(shù)要求 31頁
J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for electronic Soldering Applications 28頁
J-STD-012 Implementation of flip chip and chip scale technology 倒裝芯片及芯片級(jí)封裝技術(shù)的應(yīng)用 120頁
J-STD-013 Implementation of Ball Grid Array & Other High Density Technology 球柵陣列(BGA)及其它高密度封裝技術(shù)的應(yīng)用(1996-07) 103頁
J-STD-020C Moisture/Reflow Sensitivity classification for Non-Hermetic Solid State Surface Mount Devices 非密封固態(tài)表面貼裝器件濕度/再流焊敏感度分類 18頁
J-STD-026 Semiconductor Design Standard for Flip Chip Applications 倒裝芯片用印制板設(shè)計(jì)標(biāo)準(zhǔn) 48頁
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations 20頁
J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒裝芯片及芯片凸塊結(jié)構(gòu)的性能標(biāo)準(zhǔn) 36頁
J-STD-032 Performance Standard for Ball Grid Array Balls 球珊陣列性能標(biāo)準(zhǔn) 17頁
J-STD-033A Standard for Handling Packing Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 對(duì)濕度、再流焊敏感表貼裝器件的處置、包裝、發(fā)運(yùn)和使用 20頁
J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非氣密封裝電子元件用聲波顯微鏡(1999-04) 20頁
IPC-T-50G Terms and Definitions for Interconnecting and Packaging Electronic Circuits 電子電路互連與封裝術(shù)語與定義 111頁
IPC-SC-60A Post Solder Solvent Cleaning Handbook 錫焊后溶劑清洗手冊(cè) 48頁
IPC-SA-61 Post Solder Semiqueous Cleaning Handbook 錫焊后半水溶劑清洗手冊(cè) 32頁
IPC-AC-62A Aqueous Post Solder Cleaning Handbook 錫焊后水溶液清洗手冊(cè) 49頁
IPC-CH-65A Guideline for cleaning of Printed Boards and Assemblies 印制板及組裝件清洗導(dǎo)則 56頁
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片組件內(nèi)層有機(jī)絕緣材料的鑒定試驗(yàn) 25頁
IPC-SG-141 Specification for Finished Fabric Woven From “S”Glass for Printed Boards 印制板用經(jīng)處理S玻璃纖維織物規(guī)范 20頁
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed boards 印制板用經(jīng)處理聚芳酰胺纖維編織物規(guī)范 17頁
IPC-QF-143 Specification for Finished Fabric Woven from Quartz （Pure Fused Silica）for Printed Boards 印制板用經(jīng)處理石英（熔融純氧化硅）纖維編織物規(guī)范 20頁
IPC-CF-148A Resin Coated Metal Foil for Printed Boards 印制板用涂樹脂金屬箔 27頁
IPC-CF-152B Composite Metallic Material Specification for Printed Wiring Boards 印制線路板復(fù)合金屬材料規(guī)范 33頁
IPC-FC-234 PSA Assembly Guilelines for Single-Sided and Double-Sided Flexible Printed Circuits 單面和雙面撓性印制電路壓敏膠粘劑組裝導(dǎo)則 31頁
IPC-FA-251 Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits 單面和雙面撓性電路組裝導(dǎo)則 44頁
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安裝技術(shù)印制板組裝件設(shè)計(jì)導(dǎo)則 146頁
IPC-A-311 Process controls for phototool Generation and Use 照相版制作和使用的過程控制 18頁
IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques 采用高速技術(shù)電子封裝設(shè)計(jì)導(dǎo)則 83頁
IPC-D-322 Guidelines for Selecting Printed Wiring Board Size Using Standard Panel Sizes 使用標(biāo)準(zhǔn)在制板尺寸的印制板尺寸選擇指南 14頁
IPC-D-325A Documentation Requirements for Printed Boards，Assemblies and support Drawings 印制板、印制板組裝件及其附圖的文件要求 94頁
IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies 制造印制板組裝件的資料要求 16頁
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers 鉆床和銑床用計(jì)算機(jī)數(shù)字控制格式 16頁
IPC-D-356B Bare Substrate Electrical Test Data Format 裸基板電檢測的數(shù)據(jù)格式 72頁
IPC-C-406 Design and Application Guidelines for Surface Mount Connectors 表面安裝連接器設(shè)計(jì)及應(yīng)用導(dǎo)則 48頁
IPC-CI-408 Solderless Surface Mount Connector Design characteristics and Application Guidelines 無焊接表面安裝連接器設(shè)計(jì)及應(yīng)用導(dǎo)則 46頁
IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Board 封入式分立布線互連板通用規(guī)范 43頁
IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards（includes amendment 1） 印制板分立線路的設(shè)計(jì)及成品要求（包括修改1） 53頁
IPC-DW-426 Specifications for Assembly of Discrete Wiring 分立線路組裝規(guī)范 31頁
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes 21頁
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 126頁
IPC-DR-570A General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards 鉆柄直徑1/8英寸的印制板用硬質(zhì)合金鉆頭通用規(guī)范 17頁
IPC-TR-578 LEADING EDGE MANUFACTURING TECHNOLOGY REPORT 100頁
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated-Through Holes in Printed Wiring Boards 印制板中小直徑鍍覆孔可靠性評(píng)價(jià)聯(lián)合試驗(yàn) 90頁
IPC-WP/TR-584 IPC White Paper and Technical Report on Halogen-Free Materials Used for Printed Circuit Boards and Assemblies 40頁
IPC-A-600G Acceptability of Printed Boards 印制板驗(yàn)收條件(2004-07) 140頁 (已出版中文版)
IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板質(zhì)量評(píng)價(jià)手冊(cè) 55頁
IPC-HDBK-610 Handbook and Guide to IPC-A-610 （Includes IPC-A-610B to C Comparison） IPC-A-610手冊(cè)及導(dǎo)則（包括IPC-A-610B 與 C的比較） 124頁
IPC-A-610D Acceptability of Electronic Assemblies 印制板組裝件驗(yàn)收條件(2005-02) 404頁
IPC-OI-645 Standard for Visual Optional Inspection Aids 目視光學(xué)檢查工具標(biāo)準(zhǔn) 51頁
IPC-TM-650 Test Methods 測試方法 861頁
IPC-QL-653A Certification of Facilities that Inspect/Test Printed Board, Components and Materials 印制板、元器件及材料檢驗(yàn)試驗(yàn)設(shè)備的認(rèn)證 29頁
IPC-MI-660 Guidelines for Incoming Inspection of Printed Board Materials 144頁
IPC-PE-740 Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和組裝的故障排除 391頁
IPC-CM-770E Guidelines for Printed Board Component Mounting 印制板元件安裝導(dǎo)則 164頁
IPC-SM-780 Component Packaging and Interconnecting With Emphasis on Surface Mounting 以表面安裝為主的元件封裝及互連導(dǎo)則 168頁
IPC-SM-782A Surface Mount Design and Land Pattern Standard（includes Amendment 1 and Amendment 2） 表面安裝設(shè)計(jì)及連接盤圖形標(biāo)準(zhǔn)（包括修訂1和2） 228頁
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation 芯片直裝技術(shù)實(shí)施導(dǎo)則 53頁
IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachment 表面安裝焊接件加速可靠性實(shí)驗(yàn)導(dǎo)則 58頁
IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive Ics 濕度/再流焊敏感集成電路的特性分級(jí)與處置程序 42頁
IPC-MC-790 Guidelines for Multichip Module Technology Utilization 多芯片組件技術(shù)應(yīng)用導(dǎo)則(1992-08)
IPC-S-816 SMT Process Guideline and Checklist 表面安裝技術(shù)過程導(dǎo)則及檢核表 46頁
IPC-CA-821 Genaral Requirements for thermally Conductive Adhesives 導(dǎo)熱膠粘劑通用要求 17頁
IPC-HDBK-830 Guidelines for Design, Selection, Application of Conformal Coatings 印制板組裝件用電絕緣復(fù)合材料的鑒定與性能 102頁
IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies（with amendment 1）印制板組裝件用電絕緣復(fù)合材料的鑒定與性能（包括修改1） 28頁
IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines 阻焊施加前及施加后清洗導(dǎo)則 25頁
IPC-SM-840C Qualification and Performance of Permanent Solder Mask 永久性阻焊的鑒定和性能 32頁 (有中文版)
IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits 厚膜多層混合電路設(shè)計(jì)標(biāo)準(zhǔn) 88頁
IPC-HM-860 Specification for multilayer Hybrid Circuits 多層混合電路規(guī)范 35頁
IPC-TF-870 Qualification and performance of Polymer Thick Film Printed Boards 聚合物厚膜印制板的鑒定和性能 30頁
IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards 多層電路板用預(yù)制內(nèi)層在制板的鑒定與性能規(guī)范 25頁
IPC-1065 Material Declaration Handbook (For Users and Manufacturers of Printed Circuit Boards ) 72頁
IPC-1066 Marking , Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies , Components and Devices 20頁
IPC-1131 Information Technology（IT）Guide for PWB Manufacturers 印制板制造商用信息技術(shù)導(dǎo)則 20頁
IPC-1902 Grid Systems for Printed Circuits 印制電路網(wǎng)格體系 8頁
IPC-2221A Generic Standard on Printed Board Design 印制板設(shè)計(jì)通用標(biāo)準(zhǔn) 124頁 (已出版中文版)
IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards 剛性有機(jī)印制板設(shè)計(jì)分標(biāo)準(zhǔn) 38頁 (已出版中文版)
IPC-2223A Sectional Design Standard for Flexible Printed Boards 撓性印制板設(shè)計(jì)分標(biāo)準(zhǔn) 36頁
IPC-2224 Sectional Standard for Dsign of PWBs for PC Cards PC卡用印制電路板設(shè)計(jì)分標(biāo)準(zhǔn) 30頁
IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 有機(jī)多芯片模塊(MCM-L)極其組裝件設(shè)計(jì)分標(biāo)準(zhǔn) 32頁
IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits 100頁
IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvias 高密度互連(HDI)與微導(dǎo)通孔設(shè)計(jì)導(dǎo)則 40頁
IPC-2511A Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology 產(chǎn)品制造數(shù)據(jù)及其傳輸方法學(xué)的通用要求 159頁
IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造數(shù)據(jù)質(zhì)量定級(jí)體系 19頁
IPC-2547 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test,Inspection and Rework 56頁
IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Descripition Data and Transfer Methodology 166頁
IPC-2615 Printed Board Dimentions and Tolerances 印制板尺寸和公差 76頁
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives 表面貼裝導(dǎo)電膠使用指南 23頁
IPC-3408 General Requirements for Anisotropically Conductive Adhesive Films 各向異性導(dǎo)電膠膜的一般要求 21頁
IPC-4101B Specification for Base Materials for Rigid and Multilayer Printed Boards 剛性及多層印制板用基材規(guī)范 109頁
IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高頻用基材規(guī)范 52頁
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials 高密度互連（ＨＤＩ）及微導(dǎo)通孔材料規(guī)范 58頁
IPC-4110 Specification and Characterization Methods for Nonwaven Cellulose Based Paper For Printed Boards 印制板用纖維紙規(guī)范及性能確定方法 23頁
IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 多層印制板用芯板結(jié)構(gòu)選擇導(dǎo)則 20頁
IPC-4130 Specification and Characterization Methods for Nonwaven “E” Glass Mat 玻璃非織布規(guī)范及性能確定方法 23頁
IPC-4411A Specification and characterization Methods for Nonwoven Para-Aramid Reinforcement 聚芳基酰胺非織布規(guī)范及性能確定方法 32頁
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 印制板化學(xué)鎳/浸金鍍層規(guī)范 40頁
IPC-4562 Metal Foil for Printed Wiring Applications 印制線路用金屬箔 36頁
IPC-5701 Users Guide for Cleanliness of Unpopulated Printed boards 未組裝印制板清潔用戶指南 12頁
IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能規(guī)范 23頁 (已出版中文版)
IPC-6012B Qulification and Performance Specification for Rigid Printed Boards剛性印制板的鑒定與性能規(guī)范 56頁 (已出版中文版)
IPC-6013A Qualification and Performance Specification for Flexible Printed Boards 撓性印制板的鑒定與性能規(guī)范 44頁 (已出版中文版)
IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Intercnnecting Structures 有機(jī)多芯片模塊(MCM-L)安裝及互連結(jié)構(gòu)的鑒定與性能規(guī)范 30頁
IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Board 高密度互連（HDI）層或印制板的鑒定與性能規(guī)范 28頁
IPC-6018 Microwave End Product Board Inspection and Test 微波成品印制板的檢驗(yàn)和測試 35頁
IPC/JPCA-6202 Performance Guide Manual for Single and Double-sided Flexible Printed Wiring Boards 單雙面撓性印制板性能手冊(cè) 107頁 (已出版中文版)
IPC/JPCA-6801 Terms and Definitions, Test Methods, and Design Examples for Build-up High Density Interconnect (HDI) Printed Wiring Boards 積層/高密度互連的術(shù)語和定義、試驗(yàn)方法與設(shè)計(jì)例 41頁 (已出版中文版)
IPC-7095A Design and Assembly Process Implementation for BGAs 球珊陣列的設(shè)計(jì)與組裝過程的實(shí)施 128頁
IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard 92頁
IPC-7525 Stencil Design Guidelines 網(wǎng)版設(shè)計(jì)導(dǎo)則
IPC-7711 Rework of Electronic Assemblies 電子組裝件的返工 193頁
IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies 印制板與電子組裝件的修復(fù)與修正 176頁
IPC-7912 Calculation of DPMO and Manufacturing Indices for Printed Board Assemblies 印制板和電子組裝件的DPMO（每百萬件缺陷數(shù)）和制造指數(shù)的計(jì)算 20頁
IPC-9151 Printed Board Process Capability,Quality,and Relative Reliability(PCQRR) Benchmark Test Standard and Database 23頁
IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 實(shí)施統(tǒng)計(jì)過程控制（SPC）的通用導(dǎo)則 52頁
IPC-9194 Implementation of Statistical Process Control (SPC) Applied to printed Board Assembly Manufacture Guideline 36頁
IPC-9201 Surface Insulation Resistance Handbook 表面絕緣電阻手冊(cè) 71頁
IPC-9261 In-Process DPMO and Estimated Yield for PWAs （印制板制造過程中DPMO（每百萬件缺陷數(shù)）和產(chǎn)量評(píng)估） 24頁
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components （Preconditioning IC components） 電子元件的印制板組裝過程模擬評(píng)價(jià)（集成電路預(yù)處理） 24頁
IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components 電子元件的印制板組裝焊接過程導(dǎo)則 23頁
IPC-9503 Moisture Sensitivity Classification for Non-IC Components 非集成電路元件的濕度敏感度分級(jí) 19頁
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成電路元件的組裝過程模擬評(píng)價(jià)（非集成電路元件預(yù)處理） 26頁
IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects 28頁
IPC-9850 Surface Mount Placement Equipment Characterization 69頁
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